TSVs mechanical stress measurements on silicon wave-guide using phase shift Interferometry
Year: 2025
Type: conference-paper
Authors: Charbonnier, Jean, Tissier, Pierre, Myko, André, Malhouitre, Stephane, Assous, Myriam, Velard, Rémi, Bernabe, Stéphane
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7081538679
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