Warpage Optimization for SiC MOSFET Multichip Fan-Out Panel-Level Packaging With Thermal–Mechanical Finite-Difference Numerical Modeling and In Situ Digital Image Correlation Validation
Year: 2025
Type: article
Authors: Wenyu Li, Wei Chen, Jing Jiang, Wenbo Wang, Yuhan Gao, Fulong Zhu, Xuejun Fan, Guoqi Zhang, Jiajie Fan
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G1747006117, G4310661758
OpenAlex ID: W7081913173