On the impact of inhomogeneities on vacancy diffusion controlled void and crack formation in SAC305 solder joints
Year: 2025
Type: article
Abstract: At elevated temperatures crack formation and propagation in metals is intrinsically tied to thermodynamic processes, such as the generation, diffusion, and condensation of vacancies. This study develops a comprehensive thermodynamic framework to model these phenomena, focusing on mesoscopic scales and utilizing principles of non-equilibrium thermodynamics. A generalized Lagrangian formulation is employed, leading to an analytical solution for crack initiation at inhomogeneities such as grain boundaries. The results highlight the role of strain energy density gradients, jog density, and diffusion-controlled dynamics in determining the evolution of fatigue. Further correlations with experimentally based Weibull damage models provide a validation pathway, providing information on the prediction of lead-free solder failure under specific thermodynamic and loading conditions.
Source: Next Materials
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $1,280
Award: G6952469671
OpenAlex ID: W7083284980
