Work

Erasing by Hot Hole Injection in eSTM device: Comprehension & Optimization

Year: 2025

Type: conference-paper

Abstract: International audience

Source: HAL (Le Centre pour la Communication Scientifique Directe)

Authors: Belabbas, Céline, Della Marca, V., Canet, Pierre, Mantelli, Marc, Kempf, Thibault, Regnier, Arnaud, Niel, Stephan, La Rosa, Francesco

Institutions: Aix-Marseille Université, Institut des Matériaux, de Microélectronique et des Nanosciences de Provence, STMicroelectronics (France)

Language: English

Topic: Semiconductor materials and devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: green

OpenAlex ID: W7084626586

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