Work

Laser Direct Writing Lithography-Enabled Fan-Out Packaging Method for Self-Adapting LED Position Deviations

Year: 2025

Type: article

Source: IEEE Transactions on Semiconductor Manufacturing

DOI: 10.1109/tsm.2025.3618470

Authors: Zongtao Li, Zhouan Wang, Jianheng Guo, Hesheng Liu, Jiasheng Li

Institution: South China University of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Natural Science Foundation of Guangdong Province

Awards: G4610009811, G5707311929

OpenAlex ID: W7085034454

FWCI:

Cites: 18

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