Work

Compensation Method for Displacement Caused by CTE Mismatch in Micro-LED Bonding Process

Year: 2025

Type: article

Source: IEEE Transactions on Electron Devices

DOI: 10.1109/ted.2025.3612907

Authors: Boyan Zhao, Min Wu, Haojie Zhou, Guoxu Fang, Xiaoxiao Ji, Luqiao Yin, Jianhua Zhang

Institution: Shanghai University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Shanghai University

OpenAlex ID: W7085159444

FWCI:

Cites: 27

Cited by:

Related to: