Work

DeepOHeat-v1: Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3619906

Authors: Xinling Yu, Ziyue Liu, Hai Li, Yixing Li, Xin Ai, Zhiyu Zeng, Ian Young, Zheng Zhang

Institutions: University of California, Santa Barbara, Intel (United States), Cadence Design Systems (United States)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Fisheries Research and Development Corporation

OpenAlex ID: W7086954110

FWCI: 1.352

Cites: 28

Cited by: 6

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