Mechanical‐Bond‐Toughened Epoxy Resins
Year: 2025
Type: article
Source: Angewandte Chemie
Authors: Chunyu Wang, Tinghao Yun, Wei You, Yi Ding, Zhiwei Fan, Guoquan Liu, Wei Yu, Xuzhou Yan
Institution: Shanghai Jiao Tong University
Language: English
Topic: Epoxy Resin Curing Processes
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G2836714604
OpenAlex ID: W7090161885