Year: 2025
Type: preprint
Abstract: As artificial intelligence (AI) chips become more powerful, the thermal management capabilities of conventional silicon (Si) substrates become insufficient for 3D-stacked designs. This work integrates electrically insulative and thermally conductive hexagonal boron nitride (h-BN) interposers into AI chips for effective thermal management. Using COMSOL Multiphysics, the effects of High-Bandwidth Memory (HBM) distributions and thermal interface material configurations on heat dissipation and hotspot mitigation were studied. A 20 °C reduction in hot spots was achieved using h-BN interposers compared to Si interposers. Such an improvement could reduce AI chips' power leakage by 22% and significantly enhance their thermal performance.
Source: arXiv (Cornell University)
Authors: Wang, Eric Han, Yan, Weijia, Huang, Ruihong
Institution: Texas A&M University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W7091187554
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