Work

Complementary Studies of Aluminum Thin Films: Resistivity and Real Structure

Year: 2025

Type: article

Source: Russian Microelectronics

DOI: 10.1134/s1063739725600554

Authors: A. A. Lomov, M. A. Tarasov, K. D. Shcherbachev, A. A. Tatarintsev, A. M. Chekushkin

Institutions: Kurchatov Institute, Russian Academy of Sciences, Kotelnikov Institute of Radioengineering and Electronics of the Russian Academy of Sciences, National University of Science and Technology

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7106789435

FWCI:

Cites: 35

Cited by:

Related to: