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RETRACTED ARTICLE: Impact of Various Core Materials on the Behavior of Through-Silicon via (TSV) Inductor in a DC/DC Converter

Year: 2025

Type: article

Source: Russian Microelectronics

DOI: 10.1134/s1063739725600268

Authors: Katepogu Rajkumar, J. Sneha Latha, Bujjibabu Nannepaga, G. Umamaheswara Reddy

Institutions: Mahatma Gandhi Institute of Technology, Sri Venkateswara University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W7106799574

FWCI:

Cites: 21

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