Year: 2025
Type: article
Abstract: Printed circuit boards (PCBs) are ubiquitous and essential electronic components. Tiny targets and high precision are the focus of PCB defect detection. This paper proposes an improved model focusing on tiny defect detection and model compression to achieve better performance in PCB defect detection. The improved model has a compact structure based on MobileNet v3 Small-CA and an image-cutting layer. Moreover, it applies an improved multi-scale fusion step with a location weighted mechanism to enhance representation performance. The proposed model outperforms state-of-the-art detection algorithms such as Faster R-CNN, EfficientDet, SSD, and YOLO v7, based on experimental results on a public synthetic PCB dataset. The proposed tiny object detection model has better performances on speed and detection accuracy, thereby benefitting the manufacturing industries associated with PCBs.
Source: Sensors
DOI: 10.3390/s25247403
Authors: Yuling Wang, Zhicheng Chen, Jie Wang, Peng Shang, Arcot Sowmya, Changming Sun
Language: English
Subfield: Industrial and Manufacturing Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $3,137
Awards: G5715714108, G8754796942, G8774041682
OpenAlex ID: W7108746771
