Wafer-level packaging integration of LPDDR5X-signal integrity design and simulation exploration
Year: 2025
Type: article
Source: Microelectronics International
Authors: Wenxue Tang, Yong Ji, Liyan Zhou, Yufei Bai, Yuan Zhu, Cheng Yang, Gang Wang, Chengqian Wang
Institution: China Electronics Technology Group Corporation
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7117162348