Effect of blending poly(2,6-dimethyl-1,4-phenylene sulfide) resin bearing vinyl groups on printed wiring boards
Year: 2025
Type: article
Abstract: To reduce transmission loss in printed wiring boards (PWBs), materials with low dielectric loss tangent, such as oligo(2,6-dimethyl-1,4-phenylene ether)-based resins, are commonly used. In this study, we fabricated PWBs blending poly(2,6-dimethyl-1,4-phenylene sulfide)-based resins (PMPS-V), in which benzene rings are connected via sulfide rather than ether bonds, and evaluated its effects. The PWBs exhibited a low loss tangent of 0.0017 and achieved UL94 V-0 flame retardancy with only one-third the conventional flame retardant content. Transmission loss and eye diagram degradation up to 30 GHz were effectively suppressed after heat testing at 150 °C. It was clarified that PMPS-V contributes to improving the thermal reliability of PWBs.
Source: IEICE Electronics Express
Authors: Daisuke Ito, Shinsuke Ishikawa, Hidenori Fujimoto, Akihiko Happoya, Makoto Nagata
Institutions: Daicel (Japan), Kobe University
Language: English
Subfield: Polymers and Plastics
Field: Materials Science
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W7117258156