Work

Directional transfer and low-temperature interconnect packaging of nano metal materials

Year: 2025

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-10-2025-0053

Authors: Siyu Chen, Deyi Chen, Yiqian Huang, Ruijie Liu, Xinyuan Wang, Ben Tian, Jianming Xu, Yun Mou

Institution: Sun Yat-sen University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Basic and Applied Basic Research Foundation of Guangdong Province

Awards: G2855603946, G6556365682

OpenAlex ID: W7117721563

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Cites: 31

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