Work

Stacked Intelligent Metasurfaces: Key Technologies, Scenario Adaptation, and Future Directions

Year: 2026

Type: article

Abstract: The advent of sixth-generation (6G) imposes stringent demands on wireless networks, while traditional 2D rigid reconfigurable intelligent surfaces (RISs) face bottlenecks in regulatory freedom and scenario adaptability. To address this, stacked intelligent metasurfaces (SIMs) have emerged. This paper presents a systematic review of SIM technology. It first elaborates on the SIM multi-layer stacked architecture and wave-domain signal-processing principles, which overcome the spatial constraints of conventional RISs. Then, it analyzes challenges, including beamforming and channel estimation for SIM, and explores its application prospects in key 6G scenarios such as integrated sensing and communication (ISAC), low earth orbit (LEO) satellite communication, semantic communication, and UAV communication, as well as future trends like integration with machine learning and nonlinear devices. Finally, it summarizes the open challenges in low-complexity design, modeling and optimization, and performance evaluation, aiming to provide insights to promote the large-scale adoption of SIM in next-generation wireless communications.

Source: Electronics

DOI: 10.3390/electronics15020274

Authors: Jiayi Liu, Jiacheng Kong

Institutions: Beijing Jiaotong University, China Academy of Railway Sciences

Language: English

Topic: Advanced Wireless Communication Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: gold

Estimated APC paid: $2,896