Surface properties of Ga–Cu based liquid-metal alloys: impact of Cu dilution, topography, and alloy liquefaction
Year: 2026
Type: article
Abstract: bond elongation, which is corroborated by ML-FF simulations; the increased Cu surface content at low temperatures is attributed to the presence of crystallized Cu-rich intermetallic compounds, as evidenced by transmission electron microscopy images. In an attempt to generalize the findings for filled d-band transition metals (TMs) in liquid Ga, first results on Ga-Ag and Ga-Au model systems are presented. The observed insights may be another step of paving the way for an insight-driven development of low-temperature melting liquid metals for heterogeneous catalysis.
Source: RSC Applied Interfaces
DOI: 10.1039/d5lf00335k
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W7118873181
