Work

Current-carrying friction induced interfacial degradation and delamination mechanism in AgCu10 alloy

Year: 2026

Type: article

Abstract: Ag-Cu alloys used in sliding electrical contacts often fail by delamination under current-carrying friction. This study examines the delamination mechanism in AgCu10 by characterizing subsurface microstructural evolution. Results show that gradient subsurface changes and incompatible deformation between the Ag-rich phase and Cu-rich phase, driven by coupled mechanical-electrical-thermal fields, are central to delamination. Near the worn surface, Cu-rich phase transforms into nano-lamellae aligned with the sliding direction, promoting microcrack initiation at Ag/Cu interfaces. Interfacial degradation involves 9R phase formation, lattice distortion, amorphization, and nanoscale recrystallization. These findings reveal the link between subsurface gradients and current-assisted delamination, offering guidance for alloy design.

Source: Materials Research Letters

DOI: 10.1080/21663831.2026.2613051

Authors: Youwang Tu, Xiuchong Zhu, Xiao Kang, Yixuan Cao, Lei Zhang

Institution: Central South University

Language: English

Topic: Electrical Contact Performance and Analysis

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: gold

Estimated APC paid: $1,459

Funder: Industrial Technologies Program