Work

An integrated multi-scale structured heat sink for the efficient heat dissipation of two-phase immersion-cooled chips

Year: 2026

Type: article

Abstract: Two-phase immersion cooling (TPIC) technology emerges as a crucial technology that exerts a profound influence on the performance of next-generation chips. It has been demonstrated that a well-designed TPIC heat sink can effectively lower the chip temperature. Nevertheless, current research reveals that for high-power chips, the chip case temperature still nears or surpasses 70[[EQUATION]], and the issue of a significant temperature difference across the chip surface is relatively pronounced. In this study, we developed an integrated multi-scale structured heat sink for efficient TPIC to substitute conventional air-cooled solutions. The experimental results demonstrate outstanding thermal performance: at a power input of 600W, the maximum case temperature remains stably below 65[[EQUATION]], with the system thermal resistance below 0.03[[EQUATION]]. High-speed visualization reveals enhanced boiling dynamics achieved through multiscale surface engineering. Micro/nano-structured coatings facilitate vapor nucleation, while macro-gear structures increase the convection area. This synergistic design achieves mean temperature reduction of 6.4% at 600W, and the average thermal resistance is decreased by 22% (down to 0.026 [[EQUATION]]) compared to the baseline surfaces. Moreover, remarkable improvements in uniformity are achieved: the maximum temperature differential is reduced by 75%, from 14.3[[EQUATION]] to 3.8°C. This design is expected to meet the heat dissipation requirements of next-generation kilowatt-level chips, thereby laying the foundation for advancements in high-power computing technologies.

Source: Thermal Science and Engineering Progress

DOI: 10.1016/j.tsep.2026.104495

Authors: Bin Li, Long Pan, Anqi Liu, Jingyang Hao, Bingyang Cao

Institutions: Tsinghua University, Lenovo (China)

Language: English

Topic: Heat Transfer and Boiling Studies

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: hybrid

Estimated APC paid: $3,000