Work

MCHB-DETR: An Efficient and Lightweight Inspection Framework for Ink Jet Printing Defects in Semiconductor Packaging

Year: 2026

Type: article

Abstract: In semiconductor packaging and microelectronic manufacturing, inkjet printing technology is widely employed in critical processes such as conductive line fabrication and encapsulant dot deposition. However, dynamic printing defects, such as missing droplets and splashing can severely compromise circuit continuity and device reliability. Traditional inspection methods struggle to detect such subtle and low-contrast defects. To address this challenge, we propose MCHB-DETR, a novel lightweight defect detection framework based on RT-DETR, aimed at improving product yield in inkjet printing for semiconductor packaging. MCHB-DETR features a lightweight backbone with enhanced multi-level feature extraction capabilities and a hybrid encoder designed to improve cross-scale and multi-frequency feature fusion. Experimental results on our inkjet dataset show a 29.1% reduction in parameters and a 36.7% reduction in FLOPs, along with improvements of 3.1% in mAP@50 and 3.5% in mAP@50:95. These results demonstrate its superior detection performance while maintaining efficient inference, highlighting its strong potential for enhancing yield in semiconductor packaging.

Source: Micromachines

DOI: 10.3390/mi17010109

Authors: Yibin Chen, Jiayi He, Zhuohao Shi, Yisong Pan, Weicheng Ou

Institution: Guangdong University of Technology

Language: English

Topic: Industrial Vision Systems and Defect Detection

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: gold

Estimated APC paid: $2,534