Work

Cohesive Zone Modeling of the Polyimide/Silicon Interface in 2.5D Packaging by Nanoindentation Testing

Year: 2026

Type: article

Source: Journal of Electronic Packaging

DOI: 10.1115/1.4070886

Authors: Pan Ren, Shaohui Liu, Yaya Liang, Cong Liu, Pingan Du

Institution: University of Electronic Science and Technology of China

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G8603420406

OpenAlex ID: W7124180965

FWCI:

Cites: 20

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