Work

Review of Preparing Low-Dielectric Epoxy Resin Composites

Year: 2026

Type: article

Abstract: The rapid advancement of fifth-generation (5G) communication technologies has increased the demand for high-frequency circuits that offer high signal transmission rates and low latency. Traditional epoxy resin materials, characterized by their high dielectric constant (εr) and dielectric loss (tanδ), lead to significant signal attenuation and reflection in high-frequency applications, thus limiting their suitability for modern communication devices. Accordingly, reducing the dielectric constant and dielectric loss of epoxy resins has become a prominent research focus in materials science. This paper reviews various methods for developing low-dielectric epoxy resin composites, emphasizing strategies to reduce polarization and material density. It subsequently provides a concise analysis of the advantages and current challenges associated with each technique and offers insights into potential future research directions.

Source: Coatings

DOI: 10.3390/coatings16010118

Authors: Jingwei Liu, Pingping Ming, Zijian Zhou, Tianyong Zhang, Qifeng Liu, Bing Du

Institutions: Tianjin University, Chongqing University of Science and Technology, Chongqing University

Language: English

Topic: Epoxy Resin Curing Processes

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: gold

Estimated APC paid: $3,137

Funder: National Natural Science Foundation of China