Work

Synergistically promoted direct bonding of nanotwinned copper at 200 °C viareductive solvents

Year: 2026

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-11-2025-0066

Authors: Zehao Zhao, Wei Wu, Li-Yin Gao, Zhi-Quan Liu

Institutions: Chinese Academy of Sciences, Shenzhen Institutes of Advanced Technology, University of Chinese Academy of Sciences, Southern University of Science and Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G4011486759

OpenAlex ID: W7124731783

FWCI: 1.766

Cites: 14

Cited by: 1

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