Investigation of tin whisker growth behavior in COTS components under thermal vacuum cycling
Year: 2026
Type: article
Source: Materials Testing
DOI: 10.1515/mt-2025-0373
Authors: Renxin Wan, Yongxin Zhu, Zhenlong Zhang, Xiaochao Yang, Jiaqiang Liu
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7124873300