Work

Study of the bonding force at the Au-Ag bump/TiW interface in wire bonding

Year: 2026

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-11-2025-0067

Authors: Bo-Wen Cai, Jia-Qi Wang, Qi Zhang, Li-Yin Gao, Changyou Ren, Zhi-Quan Liu

Institutions: University of Science and Technology of China, Chinese Academy of Sciences, Shenzhen Institutes of Advanced Technology, Southern University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7124956292

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Cites: 14

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