Work

Three-Dimensional Monolithic CNT Circuit Integration for Photoelectric Amplification Applications

Year: 2026

Type: article

Source: Nano Letters

DOI: 10.1021/acs.nanolett.5c05498

Authors: Mengjuan Li, Yuanhao Jin, Haitao Yang, Lihui Zhang, Jiaping Wang, Shoushan Fan, Qunqing Li

Institution: Tsinghua University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, National Key Research and Development Program of China

Awards: G3555818150, G6580096324

OpenAlex ID: W7125774659

FWCI:

Cites: 40

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