Year: 2025
Type: article
Abstract: As semiconductor devices become increasingly complex, heterogeneous integration has become essential to meet the demands of high-performance applications. Advanced packaging technologies are required to integrate multiple functional components into a compact form factor, all while achieving the electrical performance, mechanical stability, and manufacturability required for high volume production. The M-Series Fan-out Interposer Technology (M FIT) directly addresses these challenges by combining molded fan-out redistribution layer (RDL) technology with embedded bridge die. These bridge die, fabricated using the same RDL technology, serve as high-bandwidth, low-latency interconnects between active chiplets. This paper details the process flow for M FIT, with a focus on the benefits of RDL-based bridge die and the opportunity to fabricate the interposer in a carrier-less full thickness process with prefabricated interconnect blocks.
Source: IMAPSource Proceedings
DOI: 10.4071/001c.151179
Authors: Robin Davis, Benedict San Jose
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W7125785752
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