Year: 2025
Type: article
Abstract: The CHIPS Act renewed domestic focus on semiconductor technology, including advanced packaging that is critical for chiplets and future scaling. Arizona State University’s core facilities, industry partnerships, course offerings, and workforce development programs are evolving quickly to meet these challenges with initiatives like the Southwest Advanced Prototyping (SWAP) Hub, Center for Advanced Wafer-Level Packaging Applications & Development, and the Materials-to-Fab center. In addition, under the National Advanced Packaging Manufacturing Program (NAPMP), ASU is leading the Substrate-based Heterogeneous Integration Enabling Leadership Demonstration for the USA (SHIELD USA) program in collaboration with Deca Technologies and major industry partners, to rethink how organic substrates are manufactured. Processes, materials, and equipment borrowed from fan-out wafer-level and panel-level packaging will enable scaling down to features sizes that are only available on interposers today and scaling out to 100s-1000s of chiplets. ASU is all in on Advanced Packaging R&D and is quickly becoming a leader in this space.
Source: IMAPSource Proceedings
DOI: 10.4071/001c.147778
Author: Jason Conrad
Institution: Arizona State University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W7125810106