Effect of Physical Control Parameters and Hydrodynamic Behavior on Copper Electrodeposition Efficiency: A Numerical Simulation Study
Year: 2026
Type: article
Abstract: This study concerns the simulation of copper electrodeposition and related phenomenological and technological aspects as influenced by electrode geometry and electrolyte flow velocity. A multiphysics simulation approach was employed, integrating mathematical models accounting for electrochemical deposition and hydrodynamic behavior. Ionic transport is described by the Nernst-Planck equations, electrode kinetics by Butler–Volmer expressions, and fluid flow by the Navier–Stokes equations. Simplified 2D and 3D models were developed to investigate industrial frame plating electrodeposition processes. The results indicate that the fluid direction of the solution in relation to the position of the substrate within the electrodeposition cell enables the distribution of the thickness of the coating to be optimized. Numerical simulation can be used to guide the choice of the orientation of cathodes to be electroplated inside the electroplating tank, to take into consideration agitation direction, and to achieve the best deposit uniformity.
Source: Coatings
Authors: Marco Bonechi, Salvatore Di Sivo, Giacomo Zambelli, Walter Giurlani, Jonathan Campeggio, Marina Macchiagodena, Fabio Biffoli, Elena Colombini, Roberto Giovanardi, Claudio Fontanesi, Massimo Innocenti, Marco Pagliai
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $3,137
OpenAlex ID: W7125971147