Work

Investigation on the effect of die-attaching on the mechanical properties and microstructure of nano-Cu sintered joints

Year: 2026

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-11-2025-0070

Authors: Quanyi Liu, Zhicheng Ding, Hongsheng Sun, Biao Liu, Yang Liu

Institution: Harbin University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Key Research and Development Program of Heilongjiang, National Natural Science Foundation of China

Awards: G2853447699, G4972395705

OpenAlex ID: W7126267076

FWCI:

Cites: 35

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