Low-Temperature Ru–Ru Hybrid Bonding: Ar/H 2 Plasma and NH 4 OH Synergistic Activation for Ultrahigh Density Interconnection
Year: 2026
Type: article
Institutions: Harbin Institute of Technology, Meisei University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G385916027, G5796035613
OpenAlex ID: W7128018170