Cold, Rapid, and Scalable Stamping of Aramid‐Networked Viscoelastic h‐BN Doughs for Complex Thermal Architectures
Year: 2026
Type: article
Source: Advanced Materials
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
Awards: G1847109357, G7144694421
OpenAlex ID: W7128054541
