Work

Comparative analysis of the fatigue life of the FLASH under joint error conditions

Year: 2026

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-11-2025-0064

Authors: Le Lei, Bing Lei, Lingbo Li

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7128075165

FWCI:

Cites: 8

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