Research on the Engineering and Technological Features of the 3D Assembly and Mounting of a Functional Micromodule
Year: 2025
Type: article
Source: Russian Microelectronics
Authors: A. Yu. Titov, A. I. Pogalov, S. P. Timoshenkov
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7128357222