Work

Development and Research on Multichip Microsystems Based on Modular Three-Dimensional Integration of Chips

Year: 2025

Type: article

Source: Russian Microelectronics

DOI: 10.1134/s1063739725700155

Authors: E. Yu. Chugunov, S. P. Timoshenkov, A. I. Pogalov

Institution: National Research University of Electronic Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W7128370041

FWCI:

Cites: 7

Cited by:

Related to: