Work

Optimizing thickness uniformity in double-pulse nickel electroforming via a physics-guided COMSOL®–ANN–WOA framework

Year: 2026

Type: article

Source: Proceedings of the Institution of Mechanical Engineers Part E Journal of Process Mechanical Engineering

DOI: 10.1177/09544089261419665

Authors: Chen Chen, Jingang Liu, Kui Song

Institution: Xiangtan University

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Natural Science Foundation of Hunan Province, Hunan Provincial Innovation Foundation for Postgraduate

Awards: G2997880176, G4318074524, G6212226519, G970555545

OpenAlex ID: W7128428495

FWCI: 1.692

Cites: 24

Cited by: 1

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