Work

Research on the influence of intermetallic compounds on the reliability of lead-free solder joints under thermal cycling loads

Year: 2026

Type: article

Source: Microelectronics International

DOI: 10.1108/mi-06-2025-0120

Authors: Xuexia Yang, Miao Zhu, Yanxi Sun, Jinbao Lin, Xin Hao, Xuefeng Shu, Gesheng Xiao

Institutions: Taiyuan University of Science and Technology, Taiyuan University of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Awards: G1784661915, G8030013277, G8087303410

OpenAlex ID: W7128495398

FWCI:

Cites: 28

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