Work

Cyclic Oxidation–Reduction Cleaning for Microstructural and Chemical Restoration of Copper after Chemical Mechanical Polishing

Year: 2026

Type: article

Source: ACS Applied Electronic Materials

DOI: 10.1021/acsaelm.5c02225

Authors: Cheng-Hsuan Kuo, Jit Dutta, Hyeokin Ko, Dipayan Pal, Madison Manley, Rohan Sahay, Danish Baig, Muhannad Bakir, Charles H. Winter, Carl V. Thompson, Andrew C. Kummel

Institutions: University of California San Diego, Georgia Institute of Technology, Wayne State University, Massachusetts Institute of Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Semiconductor Research Corporation

Award: G6514625254

OpenAlex ID: W7128617588

FWCI: 1.715

Cites: 36

Cited by: 1

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