Work

Chiplet Design Automation: Methodologies, Advances, and Directions

Year: 2026

Type: article

Source: ACM Transactions on Design Automation of Electronic Systems

DOI: 10.1145/3796529

Authors: Fuping Li, Ding Yuan, Jixiang Zhu, Xihao Liang, Juelei Zhou, Tian Miao, Hui Li, Kai Zhang, Yinhe Han, Huawei Li, Xiaowei Li, Ying Wang, Yujie Wang

Institutions: Chinese Academy of Sciences, Institute of Computing Technology, University of Chinese Academy of Sciences, Inspur (China)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G4186738866

OpenAlex ID: W7128634769

FWCI: 3.385

Cites: 46

Cited by: 2

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