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Efficient, Non‐Destructive Transfer of Wafer‐Scale Monolayer MoS 2 by Interface Engineering (Adv. Funct. Mater. 12/2026)

Year: 2026

Type: article

Abstract: Interface Engineering This cover image illustrates efficient, non-destructive transfer of wafer-scale monolayer MoS2 through interface engineering. The visual highlights MoS2 on the surface with a magnifying crystal structure, a PDMS interface, and a sapphire substrate. Lifted films reveal weak substrate bonding, offering new insights toward transfer and device application for 2D materials. More information can be found in the Research Article by Zhihua Zhang, Dongxia Shi, Luojun Du, and co-workers (10.1002/adfm.202517643).

Source: Advanced Functional Materials

DOI: 10.1002/adfm.73861

Authors: Zheng Wei, Yongqing Cai, Jieying Liu, Liyan Zhang, Jiaojiao Zhao, Jian Tang, Lu Li, Qinqin Wang, Huimin Zhang, Zhihua Zhang, Dongxia Shi, Luojun Du

Institutions: Chinese Academy of Sciences, Institute of Physics, University of Chinese Academy of Sciences, Dalian Jiaotong University, Dalian University of Technology, Songshan Lake Materials Laboratory

Language: English

Topic: 2D Materials and Applications

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: bronze

OpenAlex ID: W7128740534

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