Work

Embedded PCB and DBC-integrated design of 650 V GaN power modules with enhanced thermal and electrical performance

Year: 2026

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2026.116053

Authors: A. Yeong Choi, Jaejin Jeon, Jae Hyuk Lim, Sang Won Yoon

Institutions: Seoul National University, Samsung (South Korea), Samsung Electronics (South Korea)

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: Ministry of Trade, Industry and Energy, National Research Foundation of Korea, Ministry of Science and ICT, South Korea, Samsung, Korea Evaluation Institute of Industrial Technology

Awards: G7438821695, G7544679996, G933621119

OpenAlex ID: W7128780223

FWCI:

Cites: 24

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