Work

High-Power and Fiber-Solid Hybrid MOPA Nanosecond Laser for High-Efficiency 4H-SiC Wafers Slicing

Year: 2026

Type: article

Abstract: Laser slicing of 4H-SiC wafers offers high efficiency and minimal material loss. While nanosecond lasers are the preferred light source, simultaneously achieving high output power, excellent beam quality (M2 < 1.3), and broad operational tunability remains an outstanding challenge. This study developed a highly efficient nanosecond laser source using hybrid fiber and solid-state multi-stage amplification architecture. With excellent beam quality (M2 < 1.3), it achieves the highest output power, widest continuously tunable pulse width range, and broadest repetition rate range currently reported for 4H-SiC laser slicing. This advancement is poised to advance the continued development of 4H-SiC slicing technology.

Source: Fibers

DOI: 10.3390/fib14020026

Authors: Chunquan Hong, Jincheng Wen, Huailiang Liu, Libo Wang, Lin Zhang, Xiuquan Ma

Institutions: State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology

Language: English

Topic: Solid State Laser Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: gold

Estimated APC paid: $2,413

Funder: National Key Research and Development Program of China