Work

Epoxy Molding Compound for Electronic Packaging: Impact of Inorganic Filler Type and Geometry

Year: 2026

Type: article

Source: Journal of Electronic Packaging

DOI: 10.1115/1.4071141

Authors: Eyann Lee, Muhamed Abdul Fatah Muhamed Mukhtar, Abdullah Aziz Saad, Mariatti Jaafar

Institution: Universiti Sains Malaysia

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Intel Corporation, Universiti Sains Malaysia

Awards: G3241850610, G6183444332

OpenAlex ID: W7129425821

FWCI: 1.766

Cites: 54

Cited by: 1

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