Thermomechanical Finite Element Analysis of Cu–SiCN Hybrid Bonding With Protruding and Recessed Cu Pad in Three-Dimensional Integrated Circuits
Year: 2026
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.4071198
Institution: Huazhong University of Science and Technology
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7130848854