Year: 2026
Type: article
Abstract: This study presents a high-performance MEMS accelerometer employing a symmetrical differential 'sandwich' capacitive structure. An orthogonal rectangular compensation method was integrated with wet anisotropic etching to achieve high structural symmetry. An innovative glass-silicon composite cover plate was adopted, and the upper and lower plates were encapsulated by a sensitive structure via anodic bonding, which effectively reduced the parasitic capacitance. Simulations confirmed sufficient separation between the sensitive-axis (Z-axis) resonant frequency and orthogonal/torsional modes, ensuring low cross-axis coupling. The fabricated device exhibits high sensitivity (0.2216 V/g) and excellent linearity (99.842%) within a 0-8 g range. Furthermore, it demonstrates outstanding noise (7.88 µg/√Hz) and bias-instability (6.39 µg) performance, positioning it competitively against commercial counterparts. The proposed design and process offer a viable technical route for high-precision inertial sensing applications.
Source: Micromachines
DOI: 10.3390/mi17020271
Authors: Zihan Wang, Chaowei Si, Jihua Zhang, Zhen Fang, Jinxu Liu, Shuqi Li, Wanli Zhang
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $2,534
Award: G3553091275
OpenAlex ID: W7130940720