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Laser-Assisted Bonding with Through-Silicon Alignment for Heterogeneous Integration onto Silicon Photonic Platform

Year: 2025

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc67330.2025.11392637

Authors: Aleksandr Vlasov, Evgenii Lepukhov, Joel Salmi, Heidi Tuorila, Jukka Viheriälä, Mircea Guina

Institutions: Tampere University, University of Tampere

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W7131260089

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Cites: 27

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