Work

Modeling and Improvement of Heat-Flow Paths Inside 3D-nand First-Level Packages With Internal Metal Structures

Year: 2026

Type: article

Source: IEEE Transactions on Electron Devices

DOI: 10.1109/ted.2026.3667123

Authors: Hobeom Han, Jung Su Yoon, Eun Pyo Hong, Suk-Kang Sung, Sang Won Yoon

Institutions: Seoul National University, Samsung (South Korea), Samsung Electronics (South Korea)

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Samsung

OpenAlex ID: W7133339920

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Cites: 23

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