Flexible Electronic Devices Encapsulation Technology: Materials, Processes, and Applications
Year: 2026
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.4071329
Institution: Shanghai University of Engineering Science
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G7566959114
OpenAlex ID: W7133649041