Work

Application of Nonlinear Fracture Mechanics Parameter Δ T * to Estimating Wire-Liftoff Lifetime: Effect of Creep Constitutive Equations

Year: 2026

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2026.3672652

Authors: Nobuyuki Shishido, Yutaka Hayama, Saya Okamoto, Yusuke Shigyo, Shinya Taketomi, Masaaki Koganemaru, Seiya Hagihara, Noriyuki Miyazaki

Institutions: Kindai University, Saga University, Kagoshima University, Kyoto University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7134959142

FWCI:

Cites: 18

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Related to: 10