Year: 2026
Type: article
Abstract: The corrosion behavior and mechanism of Cu soaked in ammonia water were studied at 30°C using open circuit potential (OCP), electrochemical impedance spectroscopy (EIS) and polarization curve, combined with optical microscopy, scanning electron microscopy (SEM), X-ray powder diffractometer (XRD), energy dispersive spectrometer (EDS), X-ray photoelectron spectroscopy (XPS), and Fourier transform infrared spectroscopy (FT-IR) and other analytical techniques. The findings demonstrated that when the concentration of ammonia water increased from 0.1 wt.% to 1.0 wt.%, the corrosion rate of Cu increased from 21.9 μA/cm 2 to 32.3 μA/cm 2 , and when the temperature of ammonia water increases from 30°C to 50°C, the corrosion rate of Cu increased from 30.2 μA/cm 2 to 68.5 μA/cm 2 . The surface of Cu had obvious oxidation discoloration in ammonia water, the corrosion reactions of Cu in ammonia water involved oxidation-reduction and complexation process, and ammonia formed copper-ammonia complexes with Cu (I) and Cu (II), destroying the Cu surface protective film and accelerating oxidation corrosion. In ammonia water, the corrosion products of Cu were Cu 2 O, CuO, Cu(OH) 2 and copper-ammonia complexes.
Source: Arabian Journal of Chemistry
Authors: Jinbei He, Lingzhi Chen, Hualiang Huang
Institution: Wuhan Institute of Technology
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: hybrid
Estimated APC paid: $1,490
Funder: Wuhan Institute of Technology
OpenAlex ID: W7135084867